~Board Thickness
Rigid: 1.5mm +/-0.15
Flex: 0.13mm +/-0.03
Material
FR4 TG170 +Polyimide (Adhesiveless)
Copper Thickness
1/1/1/1/1/1/1/1 OZ
Stiffener
None
Min. Line Width/ Spacing
4mil (0.10mm)/4mil (0.10mm)
Coverlay
Yellow
Silkscreen Color
White
Solder mask Color
Green
Surface Finishing
ENIG（Ni: 3-5um/Au: 0.05um)
Layer Count
8 Layer （6rigid+2flex）
Impedance controlled
50Ω±10%, differential 100Ω ±10%
Min.Quantity of Order
No MOQ
