Product Description

~Board Thickness

 Rigid: 1.5mm +/-0.15

 Flex: 0.13mm +/-0.03

 Material

 FR4 TG170 +Polyimide (Adhesiveless)

 Copper Thickness

 1/1/1/1/1/1/1/1 OZ

 Stiffener

 None

 Min. Line Width/ Spacing

 4mil (0.10mm)/4mil (0.10mm)

 Coverlay

 Yellow
 Silkscreen Color

 White

 Solder mask Color

 Green

 Surface Finishing

 ENIG（Ni: 3-5um/Au: 0.05um)

 Layer Count

 8 Layer （6rigid+2flex）

 Impedance controlled

 50Ω±10%, differential 100Ω ±10%

 Min.Quantity of Order

 No MOQ

Payment Terms︰ T/T